Problem size reduction in thermal models

de Cogan, D. (1997) Problem size reduction in thermal models. In: IEE Colloquium on Modelling and Simulation for Thermal Management (Digest No. 1997/043), 1997-01-01.

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Abstract

As computing power increases there is a natural tendency to use it to tackle larger problems in greater detail. The perfect description of a semiconductor device may provide an exact measure of the power dissipation. But when it is realised that the chip is on a header, encapsulated in a package which is attached to one of many circuit boards within a cabinet, etc., then it is time to stand back and look at the forest and ignore the stomata on the leaves on the trees. This paper provides a tour of the problem, highlights some recent developments and suggests areas which might be usefully investigated in the future.

Item Type:	Conference or Workshop Item (Other)
Faculty \ School:	Faculty of Science > School of Computing Sciences
Depositing User:	EPrints Services
Date Deposited:	01 Oct 2010 13:42
Last Modified:	24 Sep 2024 07:17
URI:	https://ueaeprints.uea.ac.uk/id/eprint/3838
DOI:	10.1049/ic:19970272

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