Propagation analysis for thermal modeling
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de Cogan, D. (1998) Propagation analysis for thermal modeling. IEEE Transactions on Components Packaging and Manufacturing Technology Part A, 21 (3). pp. 418-423.
Full text not available from this repository.| Item Type: | Article |
|---|---|
| Faculty \ School: | Faculty of Science > School of Computing Sciences |
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| Depositing User: | EPrints Services |
| Date Deposited: | 01 Oct 2010 14:42 |
| Last Modified: | 25 Jul 2018 08:03 |
| URI: | https://ueaeprints.uea.ac.uk/id/eprint/3847 |
| DOI: | 10.1109/95.725205 |
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