Propagation analysis for thermal modeling
Tools
de Cogan, D. (1998) Propagation analysis for thermal modeling. IEEE Transactions on Components Packaging and Manufacturing Technology Part A, 21 (3). pp. 418-423.
Full text not available from this repository.Item Type: | Article |
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Faculty \ School: | Faculty of Science > School of Computing Sciences |
Related URLs: | |
Depositing User: | EPrints Services |
Date Deposited: | 01 Oct 2010 14:42 |
Last Modified: | 25 Jul 2018 08:03 |
URI: | https://ueaeprints.uea.ac.uk/id/eprint/3847 |
DOI: | 10.1109/95.725205 |
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