Propagation analysis for thermal modeling

de Cogan, D. (1998) Propagation analysis for thermal modeling. IEEE Transactions on Components Packaging and Manufacturing Technology Part A, 21 (3). pp. 418-423.

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Item Type: Article
Faculty \ School: Faculty of Science > School of Computing Sciences
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Depositing User: EPrints Services
Date Deposited: 01 Oct 2010 14:42
Last Modified: 25 Jul 2018 08:03
URI: https://ueaeprints.uea.ac.uk/id/eprint/3847
DOI: 10.1109/95.725205

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